<?xml version="1.0" encoding="utf-8" standalone="yes"?><rss version="2.0" xmlns:atom="http://www.w3.org/2005/Atom"><channel><title>Daniel Green Marques | Soft and Printed Microelectronics</title><link>https://spm.isr.uc.pt/author/daniel-green-marques/</link><atom:link href="https://spm.isr.uc.pt/author/daniel-green-marques/index.xml" rel="self" type="application/rss+xml"/><description>Daniel Green Marques</description><generator>Hugo Blox Builder (https://hugoblox.com)</generator><language>en-us</language><lastBuildDate>Mon, 01 Mar 2021 00:00:00 +0000</lastBuildDate><image><url>https://spm.isr.uc.pt/media/logo_hu812123383817748296.png</url><title>Daniel Green Marques</title><link>https://spm.isr.uc.pt/author/daniel-green-marques/</link></image><item><title>Bi-Phasic Ag–In–Ga-Embedded Elastomer Inks for Digitally Printed, Ultra-Stretchable, Multi-layer Electronics</title><link>https://spm.isr.uc.pt/publication/lopes-bi-phasic-2021/</link><pubDate>Mon, 01 Mar 2021 00:00:00 +0000</pubDate><guid>https://spm.isr.uc.pt/publication/lopes-bi-phasic-2021/</guid><description/></item><item><title>EGaIn‐Assisted Room‐Temperature Sintering of Silver Nanoparticles for Stretchable, Inkjet‐Printed, Thin‐Film Electronics</title><link>https://spm.isr.uc.pt/publication/tavakoli-egainassisted-2018/</link><pubDate>Sun, 01 Jul 2018 00:00:00 +0000</pubDate><guid>https://spm.isr.uc.pt/publication/tavakoli-egainassisted-2018/</guid><description/></item></channel></rss>